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CKCW0603H
Energy storage
High Q value and high self-resonant frequency with Ferrite material.
Small chip suitable for surface mounting.
Tight inductance tolerance and high reliability.
Product Info
Product Uses
1. Mobile phone TD-LTE/5G communication.
2. High frequency circuit in communication equipments.
3. Bluetooth , W-LAN , Broadband network.
Product Parameters
Sample Apply
Series
Model
PDF
Inductance
(μH)
CommonMode
(Ω)
Impedance
(Ω)
Inductance/
Impedance tolerance
Test conditions
DCR
(mΩ)
Isat
TYP(A)
Irms
TYP(A)
Use
State
Temperature
(℃)
Length
(mm)
Width
(mm)
Height
(mm)
Package
Shield
Material
3D Image
Wire Wound Chip Ferrite Inductor
CKCW0603H-10uH/□
10
-
-
±5%/±10%/±20%
2.5MHz
2400
0.300
-
consumer
In Production
-25~125
1.8
1.12
1.02
SMD
N
NiZn Ferrite
Wire Wound Chip Ferrite Inductor
CKCW0603H-4.7uH/□
4.7
-
-
±5%/±10%/±20%
7.9 MHz
980
0.420
-
consumer
In Production
-25~125
1.8
1.12
1.02
SMD
N
NiZn Ferrite
Wire Wound Chip Ferrite Inductor
CKCW0603H-2.2uH/□
2.2
-
-
±5%/±10%/±20%
7.9 MHz
500
0.600
-
consumer
In Production
-25~125
1.8
1.12
1.02
SMD
N
NiZn Ferrite
Wire Wound Chip Ferrite Inductor
CKCW0603H-1.0uH/□
1
-
-
±5%/±10%/±20%
7.9 MHz
320
0.800
-
consumer
In Production
-25~125
1.8
1.12
1.02
SMD
N
NiZn Ferrite
Notes
■ All data is tested under the condition of ambient temperature of 25℃.
■ Inductance test condition is 100kHz, 1.0V.
■ Saturation current: the actual DC current value applied when the inductance value drops by 30% from its initial value.
■ Temperature rise current: the actual DC current value applied to raise the product temperature by ΔT40℃ (Ta=2567℃).
■ Special reminder: Circuit design, component layout, printed circuit board (PCB) size and thickness, and heat dissipation system can all affect the product temperature.
■ Please make sure to verify the heat dissipation status of the product in the final application.
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■ Storage conditions for the product in packaging: Temperature of 5-40°C, relative humidity ≤ 70%.
■ If removed for use, please seal the remaining product in a plastic bag and store it according to the above conditions to prevent oxidation of the terminals (electrodes) and affect the soldering status.
■ It is not recommended to store the product for more than 2549 months as the terminals may degrade under other influences, leading to poor solderability.
■ Please do not store the product in environments with high temperature, high humidity, dust, or corrosive gases.
■ Handle with care and avoid damage caused by dropping or improper handling of the product.
■ Grease on hands can reduce solderability, so direct contact with terminals should be avoided.
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