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CKCW0805
Energy storage
High Q value and high self-resonant frequency with ceramic material
Small chip suitable for surface mounting
Tight inductance tolerance and high reliability
Product Info
Product Uses
1.Mobile phone TD-LTE/5G communication.
2.High frequency circuit in communication equipments.
3.Bluetooth,W-LAN, Broadband network
Product Parameters
Sample Apply
Series
Model
PDF
Inductance
(μH)
CommonMode
(Ω)
Impedance
(Ω)
Inductance/
Impedance tolerance
Test conditions
DCR
(mΩ)
Isat
TYP(A)
Irms
TYP(A)
Use
State
Temperature
(℃)
Length
(mm)
Width
(mm)
Height
(mm)
Package
Shield
Material
3D Image
Wire Wound Chip Ceramic Inductor
CKCW0805-4.7uH/□(C)
4.7
-
-
±2%/±5%/±10%
7.9 MHz
8200
-
0.03
consumer
In Production
-40~125
2.29
1.73
1.55
SMD
N
Ceramic
Wire Wound Chip Ceramic Inductor
CKCW0805-3.3uH/□(C)
3.3
-
-
±2%/±5%/±10%
7.9 MHz
5400
-
0.05
consumer
In Production
-40~125
2.29
1.73
1.55
SMD
N
Ceramic
Wire Wound Chip Ceramic Inductor
CKCW0805-2.2uH/□(C)
2.2
-
-
±2%/±5%/±10%
7.9MHz
4600
-
0.10
consumer
In Production
-40~125
2.29
1.73
1.55
SMD
N
Ceramic
Wire Wound Chip Ceramic Inductor
CKCW0805-680nH/□(C)
0.68
-
-
±2%/±5%/±10%
25MHz
2050
-
0.19
consumer
In Production
-40~125
2.29
1.73
1.55
SMD
N
Ceramic
Wire Wound Chip Ceramic Inductor
CKCW0805-560nH/□(C)
0.5600000000000001
-
-
±2%/±5%/±10%
25MHz
1900
-
0.23
consumer
In Production
-40~125
2.29
1.73
1.55
SMD
N
Ceramic
Wire Wound Chip Ceramic Inductor
CKCW0805-470nH/□(C)
0.47
-
-
±2%/±5%/±10%
50MHz
1720
-
0.25
consumer
In Production
-40~125
2.29
1.73
1.55
SMD
N
Ceramic
Wire Wound Chip Ceramic Inductor
CKCW0805-390nH/□(C)
0.39
-
-
±2%/±5%/±10%
100MHz
1500
-
0.29
consumer
In Production
-40~125
2.29
1.73
1.55
SMD
N
Ceramic
Wire Wound Chip Ceramic Inductor
CKCW0805-330nH/□(C)
0.33
-
-
±2%/±5%/±10%
100MHz
1400
-
0.31
consumer
In Production
-40~125
2.29
1.73
1.55
SMD
N
Ceramic
Wire Wound Chip Ceramic Inductor
CKCW0805-270nH/□(C)
0.27
-
-
±2%/±5%/±10%
100MHz
1000
-
0.35
consumer
In Production
-40~125
2.29
1.73
1.55
SMD
N
Ceramic
Wire Wound Chip Ceramic Inductor
CKCW0805-220nH/□(C)
0.22
-
-
±2%/±5%/±10%
100MHz
1100
-
0.40
consumer
In Production
-40~125
2.29
1.73
1.55
SMD
N
Ceramic
Wire Wound Chip Ceramic Inductor
CKCW0805-180nH/□(C)
0.18
-
-
±2%/±5%/±10%
100MHz
640
-
0.40
consumer
In Production
-40~125
2.29
1.73
1.55
SMD
N
Ceramic
Wire Wound Chip Ceramic Inductor
CKCW0805-150nH/□(C)
0.15
-
-
±2%/±5%/±10%
100MHz
560
-
0.40
consumer
In Production
-40~125
2.29
1.73
1.55
SMD
N
Ceramic
Wire Wound Chip Ceramic Inductor
CKCW0805-120nH/□(C)
0.12
-
-
±2%/±5%/±10%
150MHz
510
-
0.40
consumer
In Production
-40~125
2.29
1.73
1.55
SMD
N
Ceramic
Wire Wound Chip Ceramic Inductor
CKCW0805-100nH/□(C)
0.1
-
-
±2%/±5%/±10%
150MHz
460
-
0.40
consumer
In Production
-40~125
2.29
1.73
1.55
SMD
N
Ceramic
Wire Wound Chip Ceramic Inductor
CKCW0805-82nH/□(C)
0.082
-
-
±2%/±5%/±10%
150MHz
420
-
0.40
consumer
In Production
-40~125
2.29
1.73
1.55
SMD
N
Ceramic
Wire Wound Chip Ceramic Inductor
CKCW0805-68nH/□(C)
0.068
-
-
±2%/±5%/±10%
200MHz
380
-
0.50
consumer
In Production
-40~125
2.29
1.73
1.55
SMD
N
Ceramic
Wire Wound Chip Ceramic Inductor
CKCW0805-56nH/□(C)
0.056
-
-
±2%/±5%/±10%
200MHz
320
-
0.50
consumer
In Production
-40~125
2.29
1.73
1.55
SMD
N
Ceramic
Wire Wound Chip Ceramic Inductor
CKCW0805-47nH/□(C)
0.047
-
-
±2%/±5%/±10%
250MHz
310
-
0.50
consumer
In Production
-40~125
2.29
1.73
1.55
SMD
N
Ceramic
Wire Wound Chip Ceramic Inductor
CKCW0805-39nH/□(C)
0.039
-
-
±2%/±5%/±10%
250MHz
290
-
0.50
consumer
In Production
-40~125
2.29
1.73
1.55
SMD
N
Ceramic
Wire Wound Chip Ceramic Inductor
CKCW0805-33nH/□(C)
0.033
-
-
±2%/±5%/±10%
250MHz
270
-
0.50
consumer
In Production
-40~125
2.29
1.73
1.55
SMD
N
Ceramic
Wire Wound Chip Ceramic Inductor
CKCW0805-27nH/□(C)
0.027
-
-
±2%/±5%/±10%
250MHz
250
-
0.50
consumer
In Production
-40~125
2.29
1.73
1.55
SMD
N
Ceramic
Wire Wound Chip Ceramic Inductor
CKCW0805-22nH/□(C)
0.022
-
-
±2%/±5%/±10%
250MHz
220
-
0.50
consumer
In Production
-40~125
2.29
1.73
1.55
SMD
N
Ceramic
Wire Wound Chip Ceramic Inductor
CKCW0805-18nH/□(C)
0.018
-
-
±2%/±5%/±10%
250MHz
200
-
0.60
consumer
In Production
-40~125
2.29
1.73
1.55
SMD
N
Ceramic
Wire Wound Chip Ceramic Inductor
CKCW0805-15nH/□(C)
0.015
-
-
±2%/±5%/±10%
250MHz
170
-
0.60
consumer
In Production
-40~125
2.29
1.73
1.55
SMD
N
Ceramic
Wire Wound Chip Ceramic Inductor
CKCW0805-12nH/□(C)
0.012
-
-
±5%/±10%
250MHz
150
-
0.60
consumer
In Production
-40~125
2.29
1.73
1.55
SMD
N
Ceramic
Wire Wound Chip Ceramic Inductor
CKCW0805-8.2nH/□(C)
0.008200000000000001
-
-
±5%/±10%
250MHz
190
-
0.60
consumer
In Production
-40~125
2.29
1.73
1.55
SMD
N
Ceramic
Wire Wound Chip Ceramic Inductor
CKCW0805-6.8nH/□(C)
0.0068
-
-
±5%/±10%
250MHz
110
-
0.60
consumer
In Production
-40~125
2.29
1.73
1.55
SMD
N
Ceramic
Wire Wound Chip Ceramic Inductor
CKCW0805-3.3nH/□(C)
0.0033
-
-
±5%/±10%
250MHz
200
-
0.60
consumer
In Production
-40~125
2.29
1.73
1.55
SMD
N
Ceramic
Wire Wound Chip Ceramic Inductor
CKCW0805-2.2nH/□(C)
0.0022
-
-
±5%/±10%
250MHz
100
-
0.60
consumer
In Production
-40~125
2.29
1.73
1.55
SMD
N
Ceramic
Wire Wound Chip Ceramic Inductor
CKCW0805-47uH/□
47
-
-
±5%/±10%/±20%
2.5MHz
13800
0.055
-
consumer
In Production
-25~125
2.29
1.73
1.55
SMD
N
NiZn Ferrite
Wire Wound Chip Ceramic Inductor
CKCW0805-22uH/□
22
-
-
±5%/±10%/±20%
2.5MHz
6000
0.080
-
consumer
In Production
-25~125
2.29
1.73
1.55
SMD
N
NiZn Ferrite
Wire Wound Chip Ceramic Inductor
CKCW0805-15uH/□
15
-
-
±5%/±10%/±20%
2.5MHz
4200
0.100
-
consumer
In Production
-25~125
2.29
1.73
1.55
SMD
N
NiZn Ferrite
Wire Wound Chip Ceramic Inductor
CKCW0805-10uH/□
10
-
-
±5%/±10%/±20%
2.5MHz
3200
0.150
-
consumer
In Production
-25~125
2.29
1.73
1.55
SMD
N
NiZn Ferrite
Wire Wound Chip Ceramic Inductor
CKCW0805-6.8uH/□
6.8
-
-
±5%/±10%/±20%
7.9 MHz
2600
0.230
-
consumer
In Production
-25~125
2.29
1.73
1.55
SMD
N
NiZn Ferrite
Wire Wound Chip Ceramic Inductor
CKCW0805-4.7uH/□
4.7
-
-
±5%/±10%/±20%
7.9 MHz
2050
0.250
-
consumer
In Production
-25~125
2.29
1.73
1.55
SMD
N
NiZn Ferrite
Wire Wound Chip Ceramic Inductor
CKCW0805-3.3uH/□
3.3
-
-
±5%/±10%/±20%
7.9 MHz
1800
0.300
-
consumer
In Production
-25~125
2.29
1.73
1.55
SMD
N
NiZn Ferrite
Wire Wound Chip Ceramic Inductor
CKCW0805-2.2uH/□
2.2
-
-
±5%/±10%/±20%
7.9 MHz
310
0.400
-
consumer
In Production
-25~125
2.29
1.73
1.55
SMD
N
NiZn Ferrite
Wire Wound Chip Ceramic Inductor
CKCW0805-1.5uH/□
1.5
-
-
±5%/±10%/±20%
7.9 MHz
1200
0.400
-
consumer
In Production
-25~125
2.29
1.73
1.55
SMD
N
NiZn Ferrite
Wire Wound Chip Ceramic Inductor
CKCW0805-1.2uH/□
1.2
-
-
±5%/±10%/±20%
7.9 MHz
830
0.700
-
consumer
In Production
-25~125
2.29
1.73
1.55
SMD
N
NiZn Ferrite
Wire Wound Chip Ceramic Inductor
CKCW0805-1uH/□
1
-
-
±5%/±10%/±20%
7.9 MHz
410
0.800
-
consumer
In Production
-25~125
2.29
1.73
1.55
SMD
N
NiZn Ferrite
Wire Wound Chip Ceramic Inductor
CKCW0805-470nH/□
0.47
-
-
±5%/±10%/±20%
7.9 MHz
310
0.720
-
consumer
In Production
-25~125
2.29
1.73
1.55
SMD
N
NiZn Ferrite
Wire Wound Chip Ceramic Inductor
CKCW0805-330nH/□
0.33
-
-
±5%/±10%/±20%
10MHz
150
1.1
-
consumer
In Production
-25~125
2.29
1.73
1.55
SMD
N
NiZn Ferrite
Wire Wound Chip Ceramic Inductor
CKCW0805-220nH/□
0.22
-
-
±5%/±10%/±20%
7.9 MHz
150
1.1
-
consumer
In Production
-25~125
2.29
1.73
1.55
SMD
N
NiZn Ferrite
Notes
■ All data is tested under the condition of ambient temperature of 25℃.
■ Inductance test condition is 100kHz, 1.0V.
■ Saturation current: the actual DC current value applied when the inductance value drops by 30% from its initial value.
■ Temperature rise current: the actual DC current value applied to raise the product temperature by ΔT40℃ (Ta=2336℃).
■ Special reminder: Circuit design, component layout, printed circuit board (PCB) size and thickness, and heat dissipation system can all affect the product temperature.
■ Please make sure to verify the heat dissipation status of the product in the final application.
Save
■ Storage conditions for the product in packaging: Temperature of 5-40°C, relative humidity ≤ 70%.
■ If removed for use, please seal the remaining product in a plastic bag and store it according to the above conditions to prevent oxidation of the terminals (electrodes) and affect the soldering status.
■ It is not recommended to store the product for more than 2320 months as the terminals may degrade under other influences, leading to poor solderability.
■ Please do not store the product in environments with high temperature, high humidity, dust, or corrosive gases.
■ Handle with care and avoid damage caused by dropping or improper handling of the product.
■ Grease on hands can reduce solderability, so direct contact with terminals should be avoided.
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