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CML4532S
EMC
High common mode impedance at high frequency effects
Excellent noise suppression performance
2.20Ω~2000Ω are optional for different noise level and signal frequency
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Product Info
Product Uses
1.USB 2.0 line for personal computers and peripheral;
2.IEEE 1394 line for personal computers, DVC, STB;
3.LVDS, panel line for liquid display panels, graph card,etc;
4.USB 3.0 line or HDMI2.0 for personal computers and peripheral.
Product Parameters
Sample Apply
Series
Model
PDF
Inductance
(μH)
CommonMode
(Ω)
Impedance
(Ω)
Inductance/
Impedance tolerance
Test conditions
DCR
(mΩ)
Isat
TYP(A)
Irms
TYP(A)
Use
State
Temperature
(℃)
Length
(mm)
Width
(mm)
Height
(mm)
Package
Shield
Material
3D Image
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Wire Wound Chip Common Mode Coil
CML4532S-101-2P-T
100
-
-
＋50%/-30%
100kHz
2000
200
-
consumer
In Production
-40~125
4.5
3.2
2.8
SDM
N
NiZn Ferrite
Wire Wound Chip Common Mode Coil
CML4532S-51uH
51
-
-
＋50%/-30%
100kHz
1000
230
-
consumer
In Production
-40~125
4.5
3.2
2.8
SDM
N
NiZn Ferrite
Wire Wound Chip Common Mode Coil
CML4532S-220-2P-T
22
-
-
＋50%/-30%
100kHz
1000
310
-
consumer
In Production
-40~125
4.5
3.2
2.8
SDM
N
NiZn Ferrite
Wire Wound Chip Common Mode Coil
CML4532S-11uH
11
-
-
＋50%/-30%
100kHz
600
360
-
consumer
In Production
-40~125
4.5
3.2
2.8
SDM
N
NiZn Ferrite
Notes
All data is tested under the condition of ambient temperature of 25℃.
Inductance test condition is 100kHz, 1.0V.
Saturation current: the actual DC current value applied when the inductance value drops by 30% from its initial value.
Temperature rise current: the actual DC current value applied to raise the product temperature by ΔT40℃ (Ta=2030℃).
Special reminder: Circuit design, component layout, printed circuit board (PCB) size and thickness, and heat dissipation system can all affect the product temperature.
Please make sure to verify the heat dissipation status of the product in the final application.
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Storage conditions for the product in packaging: Temperature of 5-40°C, relative humidity ≤ 70%.
If removed for use, please seal the remaining product in a plastic bag and store it according to the above conditions to prevent oxidation of the terminals (electrodes) and affect the soldering status.
It is not recommended to store the product for more than 2015 months as the terminals may degrade under other influences, leading to poor solderability.
Please do not store the product in environments with high temperature, high humidity, dust, or corrosive gases.
Handle with care and avoid damage caused by dropping or improper handling of the product.
Grease on hands can reduce solderability, so direct contact with terminals should be avoided.
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