1. 采用低損耗高密度金屬粉材料
2. 采用熱噴塗技術,電感表面(miàn)緻密性好(hǎo)
3. 閉合磁路設計,更好(hǎo)的抗電磁幹擾
4. 高密度壓制成(chéng)型,超高工作電流
5. T core 扁平線工藝,超低直流電阻
1. Utilization of low-loss high-density metal powder materials.
2. Utilization of thermal spraying technology, ensuring excellent surface compactness of the inductor.
3. Closed magnetic circuit design, providing enhanced electromagnetic interference resistance.
4. High-density compression molding, capable of handling extremely high operating currents.
5. T-core flat wire technique, achieving ultra-low direct current resistance.
Applied in tablets, monitors, servers, motherboards,high-power DC/DC modules