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CKSTT0410
Energy storage
Magnetic shield structure,closed magnetic circuit,strong antielectromagnetic interference, ultra low buzzer,high density installation
Small volume,large current,in high frequency and high temperature environment to maintain excellent temperature current and saturation current characteristics.
Low loss alloy powder die casing,low resistance,Firm structrue,high precision of products.
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Product Info
Product Uses
1. PAD/Notebook/Desktop/Server applications,
2. DC/DC converter
Product Parameters
Sample Apply
Series
Model
PDF
Inductance
(μH)
CommonMode
(Ω)
Impedance
(Ω)
Inductance/
Impedance tolerance
Test conditions
DCR
(mΩ)
Isat
TYP(A)
Irms
TYP(A)
Use
State
Temperature
(℃)
Length
(mm)
Width
(mm)
Height
(mm)
Package
Shield
Material
3D Image
Wire Wound Molded Power Inductor
CKSTT0410U-10uH/M
10
-
-
±20%
1MHz/1V
264.0
2.4
1.9
consumer
In Production
-40~125
4.00
4.00
1.00
SMD
Y
Metal Alloy
Wire Wound Molded Power Inductor
CKSTT0410-10uH/M
10
-
-
±20%
1MHz/1V
245.0
2.4
2.1
consumer
In Production
-40~125
4.00
4.00
1.00
SMD
Y
Metal Alloy
Apply
Wire Wound Molded Power Inductor
CKSTT0410-6.8uH/M
6.80
-
-
±20%
1MHz/1V
180.0
3.0
2.3
consumer
In Production
-40~125
4.00
4.00
1.00
SMD
Y
Metal Alloy
Apply
Wire Wound Molded Power Inductor
CKSTT0410-4.7uH/M
4.70
-
-
±20%
1MHz/1V
143.0
3.5
2.8
consumer
In Production
-40~125
4.00
4.00
1.00
SMD
Y
Metal Alloy
Wire Wound Molded Power Inductor
CKSTT0410-2.2uH/M
2.20
-
-
±20%
1MHz/1V
67.0
5.3
3.6
consumer
In Production
-40~125
4.00
4.00
1.00
SMD
Y
Metal Alloy
Apply
Wire Wound Molded Power Inductor
CKSTT0410-1uH/M
1.00
-
-
±20%
1MHz/1V
38.0
6.5
3.7
consumer
In Production
-40~125
4.00
4.00
1.00
SMD
Y
Metal Alloy
Wire Wound Molded Power Inductor
CKSTT0410-0.47uH/M
0.47
-
-
±20%
1MHz/1V
20.0
8.5
7.5
consumer
In Production
-40~125
4.00
4.00
1.00
SMD
Y
Metal Alloy
Notes
All data is based on testing at an ambient temperature of 25 ℃.
The inductance test conditions are 1kHz and 1V.
Saturation current: The actual DC current value loaded when the inductance value drops by 20% of its initial value.
Temperature rise current: causes the product temperature to rise to Δ The actual DC current value loaded at T40 ℃ (Ta=25 ℃).
Special reminder: Circuit design, component layout, printed circuit board (PCB) size and thickness, and heat dissipation system can all affect product temperature.
Please be sure to verify the product's heating condition during final application.
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Storage conditions for products in packaging: temperature 5-40 ° C, relative humidity less than or equal to 70%.
If taken out for use, the remaining products should be sealed with plastic bags and stored according to the above conditions to avoid terminal (electrode) oxidation and affecting the welding status.
The storage period of the product is not recommended to exceed 12 months. Under other influences, the terminals may deteriorate, leading to poor solderability.
Please do not store the product in an unsuitable environment with high temperature, humidity, dust, or corrosive gases.
Please handle with care to avoid damage caused by product falling or improper use.
The grease on your hands can lead to a decrease in solderability, and direct contact with terminals should be avoided.
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