Cenker New Product | Ultra-thin Small Size SMD MOLDING POWER INDUCTOR
With the development of power motherboard and mobile phone power technology, the CPU main frequency is getting higher and higher, so the inductor used should have large current, low loss, low resistance, and stable power supply for system-on-chip (SoC), and the design integration of smart phones is high, the number of power circuits involved is increasing, and the ultra-thin small-size inductor brings a wider range of application needs. At present, the ultra-thin small-size integrated forming inductor CKST2012065 series developed by Senko has been successfully mass-produced.
