Cenker New Product | Ultra-thin Small Size SMD MOLDING POWER INDUCTOR
Release time:2022.09.25
Source:Cenker Technology Group

開(kāi)發(fā)背景Development Background

As smartphones, tablets, and wearable devices continue to upgrade, there is an increasing demand for miniaturization, slimness, low power consumption, low resistance, and small-sized inductors in the aspect of exterior design, leading to a broader range of application requirements.

産品特點Product Features

Using low-loss high-density metal materials; Adopting thermal spraying technology, the inductor has good surface compactness; Closed magnetic circuit design, better electromagnetic interference resistance; Ultra-low direct current resistance (DCR) and alternating current resistance (ACR).

應用領域Product Applications

Smartphones, tablets, laptops, smart wearables, VR, WiFi modules, integrated modules.

産品尺寸Product Dimensions


unit:mm

電氣特性Electrical Characteristics

Remark

All test data is reference to 25℃ ambient.

Test Condition:1MHz,1Vrms

Isat: Max.Value, DC current at which the inductance drops less than 30% from its value without current;

 Typ. Value, DC current at which the inductance drops 30% from its value without current.

Irms: For Max. Value, ΔT<40℃;for Typ. Value, ΔT is approximate 40℃.

Operat between temperature range -40℃ to +125℃(Including self - temperature rise)

Absolute maximum voltage: DC 25V

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